Hands-on: Internship leads students from Istanbul to IHP
„This year is a record number of students“, says Dr. Mehmet Kaynak, department head at IHP, Innovations for High Performance Microelectronics in Frankfurt (Oder). Nine students from Sabancı University in Istanbul have just started their three months internship in the technology department. They perform research on the common projects within the Joint Lab of IHP and Sabancı University and give also support to IHPs different projects from European Union or BMBF as well. “I could certainly state that IHP is great institution connecting academia and industry. Especially, Joint Lab provides a great opportunity to work on new technologies, innovative projects continuously throughout the year by utilizing the high competence of IHP on the state-of-art technologies”, summarises Melih Arda Duzceker, who is a senior bachelor student at Sabancı University.
The cooperation between IHP and Sabancı University has started in 2008 and more than 50 students had the opportunity to work on cutting-edge technologies under the cooperation. Overall there are eight joint labs at IHP – two international and six national ones. “For us it is a unique chance to access well qualified young students who might be working with us on a long term basis”, says Prof. Bernd Tillack, Scientific director of IHP. Moreover, it is a great opportunity for students to learn more about research life in Germany and Europe as well as getting aware of worldwide research topics, adds Mehmet Kaynak who supervises the group.
About IHP: The IHP is an institute of the Leibniz Association and conducts research and development of silicon-based systems and ultra high-frequency circuits and technologies including new materials. It develops innovative solutions for application areas such as wireless and broadband communication, security, medical technology, industry 4.0, automotive industry, and aerospace. The IHP employs approximately 300 people. It operates a pilot line for technological developments and the preparation of high-speed circuits with 0.13/0.25 µm BiCMOS technologies, located in a 1000 m² class 1 cleanroom.